The Innovation that create the future from the world of “nano-technology”.

TOK products support the evolution of semiconductor manufacturing at a nano-level and will continue to meet the expectations of society.

“The e-Material Global Company™️”

e-Material means electronic material and refers to materials in the field of electronic materials in our corporate group. As we further expand the core of electronic materials that constitute the basis of our business, we will proactively enter fields that are highly compatible with our core technologies and generate innovations by bringing venture company technologies into new business realms. In this way, we will continue to harness chemistry to march towards a prosperous future and meet the expectations of society.

TOK's Core Technology

Four main business field

Front-end process

Front-end process

The process whereby integrated circuits are crafted
onto silicon substrates to create semiconductor
chips.
Packaging process

Packaging process

The process of separating the wafer into individual
semiconductor chips, and place them into protective
package.
Image sensor and MEMS manufacturing

Image sensor and MEMS manufacturing

A field in which image sensors constituting the heart
of digital cameras and smartphone antennas (BAW
filters) are manufactured.
Panel manufacturing

Panel manufacturing

A field in which LCD and OLED displays used in
smartphones and other such devices are manufactured.

New business field

Expanding into new business fields for which our experience in existing business.

NEW
Business Field

More Information

TOK offers unique and
high value-added materials.

Support
to Venture Businesses

More Information

To innovate through teaming
of TOK core technologies
and venture businesses’
exceptional technological capabilities