Notice Regarding Investment in Inpria Corporation
TOKYO OHKA KOGYO CO., LTD. (hereinafter the “Company”) announced that it has invested 1.5 million U.S.
dollars (approx. 180 million yen) in Inpria Corporation (hereinafter “Inpria”) as one of its initiatives for commercializing EUV (Extreme Ultraviolet) resists.
The Company will advance its initiatives for commercializing EUV resists by supporting Inpria’s R&D through this investment in capital. At the same time, the Company will consider enlarging the scale of Inpria’s resist production and providing it with peripheral materials. Going forward, the Company will continue to accelerate new business development by actively seeking collaboration with promising venture businesses and providing them with support.
Details of Inpria Corporation’s announcement
Inpria announces new funding from Air Liquide, Samsung, Intel Capital and TOK, and broadens industry support
Financing to be used to complete EUV photoresist development and commence scale-up manufacturing
CORVALLIS, Ore., March 1st, 2016 – Inpria Corporation, a pioneer in high-resolution photoresists, announced today the successful closing of its most recent financing, thereby doubling the company’s total financing to date. This round was led by new investor Air Liquide Venture Capital (ALIAD) with significant participation from existing investors Samsung Venture Investment Corporation and Intel Capital. New investor Tokyo Okha Kogyo (TOK) also joined the round.
Inpria will use the proceeds to complete product development and to scale-up manufacturing for its metal oxide photoresists. With a focus on extreme ultraviolet (EUV) lithography, Inpria photoresists offer semiconductor manufacturers a purpose-built solution for semiconductor patterning at 7nm and beyond. Inpria’s products are designed not only to support critical imaging requirements but also to uniquely simplify the pattern transfer process.
“We are thrilled to have ALIAD and TOK join as our newest investors,” said Andrew Grenville, CEO of Inpria Corporation. “Their participation, along with continued support from both Samsung and Intel Capital, reflects Inpria’s progress and the industry’s increasing interest in novel patterning solutions.”
“We are delighted to take a minority stake in Inpria, an innovative technology start-up developing a new platform of inorganic patterning materials for the semiconductor industry,” said Pierre-Etienne Franc, VP Advanced Business & Technologies of Air Liquide and CEO of ALIAD.
The financing highlights expanding industry support for novel EUV resist development to improve imaging capability. “With semiconductor materials, development relationships and industry support are critical components of a successful product development process,” commented Wendell Brooks, president of Intel Capital. “Over the past two years, Inpria has demonstrated capability in both materials technology development and commercialization.”
Grenville concluded by saying, “Last year we dramatically improved the sensitivity of our photoresists and worked diligently with our partners to address key integration and performance needs. Looking ahead, we believe 2016 will be a pivotal year for our products.”
About Inpria
Inpria Corporation is a pioneer in extending semiconductor manufacturing with inorganic thin-films for nanoscale patterning. Inpria’s metal oxide photoresists for EUV lithography enable advanced performance with simplified processing. (www.inpria.com)
Company Contact: Ann Carney Nelson, acn@inpria.com, (541) 844.2812
About Air Liquide Venture Capital (ALIAD)
www.airliquide.com/connected-innovation/aliad-venture-capital
About Intel Capital
www.intelcapital.com or follow @Intelcapital
About Samsung Ventures Investment Corporation
About Tokyo Ohka Kogyo Co., Ltd. (TOK)
以 上