2025
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IEEE MEMS 2025
- Exhibit Dates
- Jan 19, 2025～Jan 23
- Venue
- Taiwan Kaohsiung
- Exhibit Contents
- MEMS, Microfluidics
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INTERNEPCON JAPAN 2025
- Exhibit Dates
- Jan 22, 2025～Jan 24
- Venue
- Tokyo Big Sight Japan
- Exhibit Contents
- Materials for semiconductor packaging field
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Semicon Korea2025
- Exhibit Dates
- Feb 19, 2025～Feb 21
- Venue
- COEX, SEOUL, KOREA
- Exhibit Contents
- Photoresist for semiconductor, materials for semiconductor packaging process
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SEMICON China 2025
- Exhibit Dates
- Mar 26, 2025～Mar 28
- Venue
- Shanghai New International Expo Centre
- Exhibit Contents
- Photoresist for semiconductor, materials for semiconductor packaging process
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ICEP-IAAC2025
- Exhibit Dates
- Apr 15, 2025～Apr 19
- Venue
- Wakasato Municipal Cultural Hall
- Exhibit Contents
- Materials for semiconductor packaging field
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Semicon South East Asia
- Exhibit Dates
- May 20, 2025～May 22
- Venue
- Sands Expo & Convention Centre
- Exhibit Contents
- Photoresist for semiconductor, materials for semiconductor packaging process
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ECTC 2025
- Exhibit Dates
- May 27, 2025～May 30
- Venue
- Gaylord Texan Resort&Convention Center Dallas, TX
- Exhibit Contents
- Materials for semiconductor packaging field
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MPS world summit 2025
- Exhibit Dates
- Jun 9, 2025～Jun 13
- Venue
- Belgium, Brussels
- Exhibit Contents
- Microfluidics, MPS
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INTERPHEX WEEK TOKYO2025
- Exhibit Dates
- Jun 24, 2025～Jun 26
- Venue
- Tokyo Big Sight Japan
- Exhibit Contents
- Microchannel and Biochips
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MNE 2025
- Exhibit Dates
- Sep 15, 2025～Sep 18
- Venue
- UK, Southampton
- Exhibit Contents
- MEMS, Microfluidics
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Bio Japan
- Exhibit Dates
- Oct 8, 2025～Oct 10
- Venue
- Pacifico Yokohama
- Exhibit Contents
- Biotechnology and Lifescience related products
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BIOPLUS-INTERPHEX KOREA 2025
- Exhibit Dates
- Oct 15, 2025～Oct 17
- Venue
- Seoul COEX
- Exhibit Contents
- SIEVEWELL, MPS, Microfluidics
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CHINANO 2025
- Exhibit Dates
- Oct 23, 2025～Oct 25
- Venue
- Suzhou, China
- Exhibit Contents
- bioMEMS
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SEMICON Europe 2025
- Exhibit Dates
- Nov 18, 2025～Nov 21
- Venue
- Trade Fair Center Messe Munich
- Exhibit Contents
- Photoresist for semiconductor, materials for semiconductor packaging process